Multilayer

Multilayer circuits of various thicknesses are made with homogeneous materials and different compositions. These circuits are manufactured according to the requirements of MIL-P-55110, IPC6012 and / or according to customer specifications and controlled according to IPC600 and with metallographic examination according to IPC250 and / or customer specifications. The entire process is controlled and verified to meet reliability and repeatability requirements.
They run Multi-Layer with Sequential Build Up technology and with RF Microwave technology and integrated digital video.